Infrastructure built around
AI's physical constraints.
Kainocore provides specialist power, cooling and interconnect technologies for high-density AI infrastructure.
High-Density AI Power
AI racks are pushing power density beyond traditional data center designs. Kainocore helps integrators and operators source specialist power infrastructure designed for increasingly dense compute environments.
- Rack and row power distribution
- High-efficiency AC/DC and DC/DC conversion
- 800VDC-ready architectures
- Intelligent power monitoring and control
Advanced Liquid Cooling
As rack density rises, air cooling increasingly becomes the limiting factor. Kainocore focuses on liquid-cooling technologies that move heat efficiently from the chip to the facility cooling loop.
- Direct-to-chip cooling
- CDUs and heat exchange
- Manifolds and quick disconnects
- Pumps, sensors and monitoring
- Facility-to-IT loop integration
AI Optical Interconnect
Large AI clusters require enormous bandwidth between compute nodes. Kainocore focuses on high-speed interconnect technologies built for scale-up and scale-out AI fabrics.
- 400G / 800G / 1.6T optics
- AOC / DAC / AEC
- Silicon photonics
- Emerging CPO / NPO architectures
- High-density optical connectivity
Working on a high-density AI infrastructure project?
Talk to Kainocore about power, cooling or interconnect technologies for your deployment.